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| (R) EMIF02-MIC02F1 IPADTM 2 LINES EMI FILTER AND ESD PROTECTION MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required : Mobile phones and communication systems s Computers, printers and MCU Boards s DESCRIPTION The EMIF02-MIC02 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. Flip Chip package BENEFITS s s s s s s s EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: 1.07mm x 1.57mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging. PIN CONFIGURATION (ball side) 3 I2 O2 2 GND GND 1 I1 O1 A B COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 Level 1 on input pins on output pins 15kV 8 kV 2kV 2kV (air discharge) (contact discharge) (air discharge) (contact discharge) MIL STD 883E - Method 3015-6 Class 3 BASIC CELL CONFIGURATION Low-pass Filter Input Output Ri/o = 470 Cline = 16pF GND TM : IPAD is a trademark of STMicroelectronics. GND GND September 2003 - Ed: 4A 1/6 EMIF02-MIC02F1 ABSOLUTE RATINGS (limiting values) Symbol Tj Top Tstg Parameter and test conditions Maximum junction temperature Operating temperature range Storage temperature range Value 125 -40 to + 85 -55 to 150 Unit C C C ELECTRICAL CHARACTERISTICS (Tamb = 25 C) Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input & Output Input capacitance per line IPP VCL VBR VRM IR IRM IRM IR VRM VBR VCL I IPP V Symbol VBR IRM RI/O Cline @ 0V IR = 1 mA VRM = 12V per line Test conditions Min. 14 Typ. 16 Max. Unit V 500 423 470 16 517 nA pF Fig. 1: S21(dB) attenuation measurement and Aplac simulation. - 10.00 dB - 15.00 - 20.00 - 25.00 - 30.00 - 35.00 Measurement Fig. 2: Analog crosstalk measurements. -20.00 dB -30.00 -40.00 I2/O1 -50.00 -60.00 - 40.00 - 45.00 Simulation -70.00 - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M f/Hz 1.0G 3.0G -80.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz 300.0M 1.0G 3.0G 2/6 EMIF02-MIC02F1 Fig. 3: Digital crosstalk measurement. Fig. 4: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and on one output (Vout). Fig. 5: ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and on one output (Vout). Fig. 6: Line capacitance versus applied voltage. C(pF) 20 18 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 11 12 VR(V) F=1MHz Vosc=30mVRMS Tj=25C 3/6 EMIF02-MIC02F1 Aplac model. I1 R_470R O1 gnd Cox MODEL = D01-int MODEL = D01-ext Cox 50pH 50pH Rsubump Rsubump MODEL = D01-gnd gnd 50m 50m Rsubump MODEL = D01-ext Cox MODEL = D01-int Rsubump Lgnd Cgnd Cgnd Rgnd O2 Lgnd Cox Rgnd I2 R_470R EMIF02-MIC02F1 model Ground return Aplac parameters. Model D01-ext BV = 7 CJO = Cz_ext IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_ext VJ = 0.6 TT = 50n Model D01-int BV = 7 CJO = Cz_int IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_int VJ = 0.6 TT = 50n Model D01-gnd BV = 7 CJO = Cz_gnd IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_gnd VJ = 0.6 TT = 50n aplacvar Ls 400pH aplacvar Rs 100m aplacvar R_470R 482.6 aplacvar Cz_ext 8.73pF aplacvar Rs_ext 850m aplacvar Cz_int 2.9pF aplacvar Rs_int 850m aplacvar Cz_gnd 215.61pF aplacvar Rs_gnd 470m aplacvar Rgnd 10m aplacvar Lgnd 48pH aplacvar Cgnd 0.15pF aplacvar Cox 3.05pF aplacvar Rsubump 200m ORDER CODE EMIF EMI Filter Number of lines yy - xxx zz F x 1: Pitch = 500m Bump = 315m 2: Leadfree Pitch = 500m Bump = 315m Flip Chip x: resistance value (Ohms) z: capacitance value / 10(pF) or Application (3 letters) and Version (2 digits) 4/6 EMIF02-MIC02F1 PACKAGE MECHANICAL DATA FLIP CHIP 500m 50 315m 50 650m 65 500m 50 1.07mm 50m FOOT PRINT RECOMMENDATIONS Copper pad Diameter : 250m recommended , 300m max Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 300m copper pad diameter MARKING Dot, ST logo xxx = marking yww = datecode (y = year ww = week) 1.57mm 50m 365 365 240 xxx y ww 40 220 All dimensions in m 5/6 EMIF02-MIC02F1 PACKING Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm 8 +/- 0.3 ST ST ST xxx yww User direction of unreeling xxx yww xxx yww 4 +/- 0.1 OTHER INFORMATION Ordering code EMIF02-MIC02F1 Marking FJT Package Flip Chip Weight 2.3 mg Base qty 5000 Delivery mode Tape & reel (7") Note: More packing informations are available in the application note AN1235: ''Flip-Chip: Package description and recommandations for use'' Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2003 STMicroelectronics - All rights reserved. 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